At TSMC’s shareholder meeting, the company said it has purchased High-NA EUV equipment but has not yet moved it into mass production due to high costs. TSMC also raised capital expenditure to $56 billion, signaling continued heavy investment in advanced manufacturing capacity. CEO C.C. Wei also pledged more than 30% annual growth in dividends and employee bonuses, while saying the company must expand its social responsibility efforts.
To bypass US semiconductor equipment sanctions, Huawei has introduced the "τ (Tau) scaling law." Instead of physical transistor shrinking, this approach focuses on reducing signal propagation delay via design-level innovations like logic folding. Huawei aims to achieve performance equivalent to a 1.4nm node by 2031, challenging TSMC's lithography-centric dominance.