Broadcom reported Q2 AI chip revenue of $10.8 billion, up 143% year over year and a new record. The growth was driven by demand for custom chips, with the company forecasting Q3 AI revenue of $16 billion, up more than 200%. Despite the strong AI outlook and the CEO’s commitment to a pure-chip strategy, shares still fell 3% after hours.
Dow presented its DOW™ Cooling Science platform at COMPUTEX TAIPEI 2026, highlighting high-performance silicone-based solutions. The platform targets thermal management challenges in AI data centers and advanced semiconductors as computing density rises. The announcement positions materials science as part of the broader AI infrastructure ecosystem, alongside industry collaboration under the “AI Together” theme.
NVIDIA CEO Jensen Huang hosted key Taiwanese supply chain partners, with senior leaders from TSMC, Foxconn, and Quanta attending the high-profile dinner. The report frames the event as a signal of Taiwan’s central role in AI hardware, from advanced chips to manufacturing and servers. Huang also said TSMC leads Huawei by 10 years, underscoring the strategic weight of semiconductor capability.