連訊通信（6820）Deepens AI High-Speed Interconnect Push
INSIDE 硬塞 AI3 days agoHardwareLianxun Communication presented next-generation AI high-speed interconnect technologies at COMPUTEX, focusing on CPO and 1.6T optical transceivers. The solutions target AI data centers’ demand for high bandwidth and low latency across compute infrastructure. The article highlights the company’s optical interconnect capabilities and strategic positioning, but does not disclose production timelines, customers, or commercial deployment details.
From Desk-Side to Data Center: Leadtek Showcases On-Prem Agentic AI Computing Strategy at COMPUTEX 2026
INSIDE 硬塞 AI4 days agoHardwareThe article says enterprise AI adoption is entering a new phase as security concerns, cloud latency, and model changes push compute needs on premises. At COMPUTEX 2026, Leadtek presented an AI compute spectrum from factory edge environments to data centers. The focus is helping companies keep tighter control over agentic AI secrets and inference responsiveness.
DeepSeek hires IDC planners, hinting at MW-to-GW data center ambitions
量子位 QbitAI5 days agoHardwareQbitAI reports that DeepSeek has listed an IDC design and planning engineer role covering data center campuses, power, cooling, networking, and capacity planning. The job description mentions participation in MW-to-GW-scale infrastructure and technologies such as dense GPU clusters, liquid cooling, smart operations, and digital twins. The article interprets this as a sign that DeepSeek may be moving beyond rented compute toward self-built AI infrastructure.
Qualcomm Unveils Dragonfly Data Center Brand for the Agentic AI Era
INSIDE 硬塞 AI13 days agoHardwareAt Computex 2026, Qualcomm described AI agents as a major driver of cross-device hardware upgrades. The company unveiled Dragonfly, a new data center brand focused on inference computing. The announcement outlines a broader strategy spanning endpoint devices and cloud infrastructure, although the source does not provide specifications, performance figures, or deployment timelines.
AI Power Demand Surges as TSMC Says Energy Efficiency Is Key to Chip Development
INSIDE 硬塞 AI16 days agoHardwareTSMC senior vice president Cliff Hou said customers across smartphones and AI data centers are increasingly focused on improving performance without increasing power use. The comment reflects rising energy pressure as AI workloads expand. For chipmakers and infrastructure buyers, energy efficiency is becoming a central metric alongside raw computing performance.
Elon Musk 已放棄（地球上的）太陽能：xAI 全力投入天然氣，SpaceX 則迷戀軌道數據中心
TechCrunch AI22 days agoCommentaryThis report indicates that tech billionaire Elon Musk appears to have abandoned the "terrestrial solar energy economy" vision he once heavily promoted. This…