「當我們要求加快量產，就應該分擔投資」蘇姿丰親解 AMD 百億美元的台灣佈局邏輯

AMD CEO Lisa Su recently personally explained the company's investment rationale behind its multi-billion-dollar commitment in Taiwan and the business logic driving it. As demand for AI and high-performance computing (HPC) chips explodes, chip design is no longer limited to architecture alone — advanced packaging technology has become the critical bottleneck determining both capacity and performance.